Semiconductor manufacturing is a complex process with three main stages: upstream (materials and equipment), midstream (wafer production), and downstream (packaging and testing). It starts with refining raw silicon into high-purity material, which is formed into monocrystalline ingots and sliced into thin wafers. During this stage, environmental air quality monitoring is critical to control particulates and maintain clean conditions for wafer production.
In the midstream phase, wafers go through oxidation, photolithography, etching, ion implantation, deposition, metallization and CMP to build the circuits and form the required semiconductor structures. The processes involve the use of specialty gases and chemicals, therefore manufacturers are required to monitor process parameters. Environmental monitoring also continues to be important at this stage to support cleanroom standard.
In the downstream stage, the processed wafers are diced into individual chips, packaged, and tested to ensure performance and reliability before delivery. During this phase, workers may be exposed to hazardous or flammable gases used in cleaning, sealing, and packaging operations. As a result, safety monitoring becomes a top priority to protect personnel and equipment, and to comply with stringent industry safety regulations.

Throughout the manufacturing processes, Cubic provides sensing solutions in three dimensions: Environmental Air Quality Monitoring (A); Process Quality Monitoring (B); Safety Production Monitoring (C). The three dimensions of solutions intersect and co-exist at different steps throughout the semiconductor production process.
Air quality monitoring is needed throughout from materials preparation and wafer production to etching and IC packaging in order to keep cleanroom conditions stable. Process quality monitoring is important during equipment operation, photolithography, and packaging to ensure consistent performance. Safety monitoring is used during materials handling, equipment use, deposition processes like CVD, and IC testing to detect dangerous conditions. The three dimensions of monitoring support each other to maintain environmental quality, process reliability, and production safety across the entire manufacturing process.